Michiaki Sugiyama
53Patents
17h-index
47Co-inventors
84Inventor score
Filing activity: Jan 12, 1998 → Sep 18, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6555918B2 | Stacked semiconductor device including improved lead frame arrangement | Emerging Cross-Sectional Technologies | 157 | Expired |
| US6479322B2 | Semiconductor device with two stacked chips in one resin body and method of producing | Electricity | 148 | Expired |
| US7296754B2 | IC card module | Electricity | 89 | Expired |
| USD552099S1 | Memory card | General | 71 | Expired |
| USD552098S1 | Memory card | General | 66 | Expired |
| US6252299A | Stacked semiconductor device including improved lead frame arrangement | Emerging Cross-Sectional Technologies | 65 | Expired |
| US6551858B2 | Method of producing a semiconductor device having two semiconductor chips sealed by a resin | Electricity | 49 | Expired |
| US6853089B2 | Semiconductor device and method of manufacturing the same | Electricity | 49 | Expired |
| USD581932S1 | Memory card | General | 37 | Expired |
| US7291903B2 | Memory card | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6410987B1 | Semiconductor device and a method of manufacturing the same and an electronic device | Electricity | 35 | Expired |
| USD556764S1 | Memory card | General | 31 | Expired |
| US7325746B2 | Memory card and semiconductor device | Physics | 26 | Expired |
| US7341198B2 | IC card and a method of manufacturing the same | Electricity | 25 | Expired |
| US6097081A | Semiconductor device having adhesive between lead and chip | Electricity | 24 | Expired |
| US7352588B2 | Semiconductor device and a method for manufacturing the same | Electricity | 23 | Expired |
| US8319352B2 | Semiconductor device | Electricity | 22 | Active |
| US7669773B2 | IC card module | Electricity | 16 | Active |
| US6410365B1 | Semiconductor device with two stacked chips in one resin body and method of producing | Electricity | 15 | Expired |
| US6885092B1 | Semiconductor device and a memory system including a plurality of IC chips in a common package | Electricity | 15 | Expired |
| USD552612S1 | Memory card | General | 13 | Expired |
| US6750080B2 | Semiconductor device and process for manufacturing the same | Electricity | 12 | Expired |
| US7971791B2 | Multi-function card device | Electricity | 11 | Active |
| US6383845B2 | Stacked semiconductor device including improved lead frame arrangement | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7308588B2 | Memory card | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.