Resin composition
US6410649B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Sep 22, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S526/943
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition characterized by comprising from 5 to 95 wt % of an aromatic vinyl compound/olefin random copolymer (A) which has an aromatic vinyl compound content of from 1 to 99 mol % and has a head-to-tail chain structure composed of two or more aromatic vinyl compound units, and from 95 to 5 wt % of an &agr;-olefin type polymer (B) and/or an aromatic vinyl compound type polymer (C) (provided that it is neither a medical material nor a medical device), which contains substantially no chlorine and is excellent in the impact resistance, moldability, weather resistance and chemical resistance and which is useful for an injection molded product, an extrusion molded product, a film, a sheet, etc. Further, it provides an excellent damping material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.