Semiconductor device and a method of manufacturing the same and an electronic device
US6410987B1 · kind B1 · utility
35Cited by
3References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 30, 1999 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Nov 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first semiconductor chip (2) is bonded and secured to a second semiconductor chip (3) with a back surface of the first semiconductor chip (2) and a circuit forming surface (3X) of the second semiconductor chip (3) facing each other, and an inner portion of a support lead (6) is bonded and secured to the circuit forming surface (3X) of the second semiconductor chip (3). Such a configuration makes it possible to provide a semiconductor with a reduced thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.