RF electronics assembly with shielded interconnect
US6411523B1 · kind B1 · utility
8Cited by
18References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Nov 22, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics assembly incorporating an interconnect includes a conductive gasket disposed between a first printed circuit board and a second printed circuit board. The gasket surrounds, and thereby shields, the interconnect while providing an RF ground connection between the two boards with a controlled RF impedance. The second printed circuit board may serve as a connector board for a plurality of modules, or other printed circuit boards, to be coupled thereto. Each module is individually covered with a separate lid. Methods for manufacturing and assembling structures according to the invention are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.