William Veitschegger
8Patents
5h-index
10Co-inventors
60Inventor score
Filing activity: Dec 7, 1994 → May 18, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6081160A | Method and apparatus for increasing the bandwidth, and reducing the size, of the DC feed network for wideband RF amplifiers using selective placement of high dielectric constant material | Electricity | 24 | Expired |
| US7400214B2 | Low loss, high power air dielectric stripline edge coupling structure | Electricity | 16 | Expired |
| US6818477B2 | Method of mounting a component in an edge-plated hole formed in a printed circuit board | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5486798A | Multiplanar hybrid coupler | Electricity | 9 | Expired |
| US6411523B1 | RF electronics assembly with shielded interconnect | Electricity | 8 | Expired |
| US10141238B1 | Semiconductor power device including adjacent thermal substrate for thermal impedance reduction | Electricity | 1 | Active |
| US6817092B2 | Method for assembling a circuit board apparatus with pin connectors | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10672688B2 | Semiconductor power device including ring frame for thermal impedance reduction | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.