Heat dissipation device for integrated circuits
US6412546B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2000 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Jul 17, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink (80) and an assembling device for securing the heat sink to a, chip (90) mounted on a printed circuit board (100). The heat sink has a pair of ears (82) each defining an aperture (84) therein. The assembling device includes a clip (70), a pair of sleeves (50) each defining a cavity (62) therethrough, and a pair of springs (60). Each sleeve extends through the aperture of a corresponding ear of the heat sink, and the springs are disposed respectively between the ears and an end of the sleeves. The clip has a pair of posts (66) for extending through the printed circuit board to engage with the corresponding cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.