Apparatus for performing chemical-mechanical planarization with improved process window, process flexibility and cost
US6413152B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1999 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Dec 22, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for chemical-mechanical planarization (CMP) of semiconductor wafers that allows independent micro-control of each spindle for tailored CMP performance. The present invention provides, in one embodiment, a CMP tool that includes a stationary bridge that houses a rack and pinion assembly. The rack and pinion assembly is coupled to a plurality of motor assemblies each of which is coupled to rotate a spindle. Significantly, movements of the spindles across are individually and independently controlled by the rack and pinion assembly. An advantage of the present independent spindle motion design allows optimization of the CMP process for each spindle and enables more accurate prediction of the effect of translation on CMP performance. Independent rotation and downforce capability of the present invention provides additional flexibility in terms of tuning polish rates and uniformity. Another advantage of the present invention is that a more compact enclosure for wafer isolation can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.