Method for handling and processing microelectronic-device substrate assemblies
US6413459B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1998 |
| Grant date | Jul 2, 2002 |
| Priority date | — |
| Expiry date | Aug 5, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Methods for selectively moving a microelectronic-device substrate assembly in a processing machine having a first side, a second side opposite the first side, and a processing path extending from the first side to the second side. The processing machine can also include a cassette proximate to a second side of the processing station that moves to position a substrate at the processing path. In one aspect of the invention, the substrate handling apparatus includes a guide member attached to the processing machine, an arm slidably attached to the guide member, and a clamp attached to the arm. The guide member is generally fixedly attached to the processing machine, and the guide member generally has a shape corresponding to the processing path. The arm can include a first section moveably attached to the guide member to translate along the guide member, and a second section projecting from the first section to position at least a portion of the second section at least proximate to the processing path. The clamp is coupled to the second section of the arm in alignment with the processing path. A motor is coupled to the arm via a drive member to move the arm along the guide member betw…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.