Modular high frequency integrated circuit structure

US6413868B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Thomas A. Bartush · Wappingers Falls, US
• David L. Harame · South Burlington, US
• John C. Malinowski · Jericho, US
• Dawn Tudryn Piciacchio · Fishkill, US
• Christopher L. Tessler · Campbell Hall, US
• Richard P. Volant · New Fairfield, US

Key dates

• Filing date: Jan 4, 2001
• Grant date: Jul 2, 2002
• Expiry date: Jan 4, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.