Process for producing a semiconductor wafer

US6416393B2 · kind B2 · utility

Assignee

• Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

• Laszlo Fabry · Burghausen, DE
• Gabriele Lechner · Marktl, DE
• Anton Schnegg · Burghausen, DE
• Andreas Ehlert · Mehring, DE

Key dates

• Filing date: Apr 2, 2001
• Grant date: Jul 9, 2002
• Expiry date: Apr 2, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/08
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A process is for producing a semiconductor wafer with a front surface and a back surface, in which the semiconductor wafer is subjected to two-sided polishing. The process includes the following: (a) producing a hydrophobic surface on the semiconductor wafer by treating the semiconductor wafer with an aqueous HF solution; (b) simultaneous polishing of the front surface and the back surface of the semiconductor wafer with a surface which has been rendered hydrophobic, with an alkaline polishing abrasive being continuously supplied between two rotating upper and lower polishing plates, which are both covered with a polishing cloth, the pH of the polishing abrasive being from pH 8.5 to pH 12.5; (c) after an intended polishing abrasion has been reached, supplying a stopping agent to the semiconductor wafer; and (d) removing the semiconductor wafer from the polishing plates. There is also a carrier for the double-side polishing of at least one semiconductor wafer, having a cutout for holding the semiconductor wafer which is lined with a shaped part made from plastic. The shaped part is constructed in such a manner that it divides a free space between an edge of the semiconductor wafer a…