Apparatus for treating silicon wafers
US6416579B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Jan 11, 2000 |
| Grant date | Jul 9, 2002 |
| Priority date | — |
| Expiry date | Jan 11, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B13/041
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An apparatus for the chemical treatment of disc-shaped semiconduct or substrates comprises a fluid-tight treatment chamber, a carrier for holding a disc-shaped substrate in the chamber, and an elongated spraying head having a plurality of nozzles for applying a fluid to at least one surface of the substrate. The spraying head is adjustably mounted in the treatment chamber and has a length corresponding at least to the diameter of the disc-shaped substrate. Fluid inlet conduits have portions leading from outside the treatment chamber into the chamber to the nozzles, and these fluid inlet conduit portions are adjustable with the spraying head. An adjustment drive displaces the spraying head transversely relative to the substrate over the surface thereof whereby the nozzles sweep over the surface in substantially parallel tracks, and at least one outlet is connected to a suction device for removing the applied fluid from the treatment chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.