Sample separating apparatus and method, and substrate manufacturing method
US6418999B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1998 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Dec 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1939
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.