Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
US6419559B1 · kind B1 · utility
17Cited by
34References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2001 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Jul 9, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a rotatable platen, a feed roller located in a cavity in the platen, a take-up roller, and a generally linear polishing sheet releasably secured to the platen to rotate with the platen. The polishing sheet has an exposed portion extending over a top surface of the platen for polishing the substrate, an unused portion wound around the feed roller, and a used portion wound around the take-up roller. A gas source direct a purge gas into the cavity containing the feed roller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.