Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
US6420093B1 · kind B1 · utility
6Cited by
24References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2000 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Feb 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0358
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.