Curable resin composition, adhesive composition, cured product and composite
US6420467B1 · kind B1 · utility
7Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1998 |
| Grant date | Jul 16, 2002 |
| Priority date | — |
| Expiry date | Sep 14, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition comprising:(1) a compound having a structure of the formula (A) and/or (B):R2—OOC—R1—COO—R2′  (A) wherein R1 is —(CH2)n— (wherein n is from 4 to 6), or an o-, m- or p-phenylene group, and each of R2 and R2′ is a C1-10 alkyl group,  wherein R3 is a C1-4 alkyl group,(2) a polymerizable vinyl monomer,(3) an organic peroxide,(4) a reducing agent, and(5) an elastomer component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.