Heat activated detachable polishing pad
US6422921B1 · kind B1 · utility
9Cited by
15References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad is adhered to a platen by a heat activated adhesive. Means are provided to heat the adhesive to a temperature sufficient to soften the adhesive, thereby facilitating removal of the polishing pad from the platen. Embodiments include employing a heat softenable adhesive that preferentially adheres to the polishing pad upon removal of the polishing pad from the platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.