Substrate-cleaning method and substrate-cleaning solution
US6423148B1 · kind B1 · utility
49Cited by
14References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 2, 1999 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Sep 2, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In cleaning a substrate which has a metal material and a semiconductor material both exposed at the surface and which has been subjected to a chemical mechanical polishing treatment, the substrate is first cleaned with a first cleaning solution containing ammonia water, etc. and then with a second cleaning solution containing (a) a first complexing agent capable of easily forming a complex with the oxide of said metal material, etc. and (b) an anionic or cationic surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.