Surface reformation method of high polymer material
US6423405B1 · kind B1 · utility
1Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1999 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Aug 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.