Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
US6423570B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2000 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Oct 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s). A portion of the encapsulation material is removed to expose a back surface of the microelectronic die which has a metallization layer disposed thereon. A protective layer is disposed on the metallization layer prior to encapsulation, such that when the portion of the encapsulation material is removed, the protective layer prevents the metallization layer from being damaged. After the portion of the encapsulation material is removed, the protective layer is removed and the metallization layer is exposed. A heat spreader may then be attached to the microelectronic die by abutting the heat spreader against the metallization layer and reflowing the metallization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.