Qing Ma
154Patents
34h-index
99Co-inventors
93Inventor score
Filing activity: Nov 19, 1997 → Jul 5, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6271469A | Direct build-up layer on an encapsulated die package | Electricity | 597 | Expired |
| US6154366A | Structures and processes for fabricating moisture resistant chip-on-flex packages | Electricity | 487 | Expired |
| US6423570B1 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Electricity | 411 | Expired |
| US6902950B2 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Electricity | 382 | Expired |
| US6713859B1 | Direct build-up layer on an encapsulated die package having a moisture barrier structure | Electricity | 319 | Expired |
| US6964889B2 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Electricity | 289 | Expired |
| US9368429B2 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Electricity | 274 | Active |
| US6229216A | Silicon interposer and multi-chip-module (MCM) with through substrate vias | Electricity | 256 | Expired |
| US6562653B1 | Silicon interposer and multi-chip-module (MCM) with through substrate vias | Electricity | 240 | Expired |
| US6709898B1 | Die-in-heat spreader microelectronic package | Electricity | 128 | Expired |
| US6586822B1 | Integrated core microelectronic package | Emerging Cross-Sectional Technologies | 122 | Expired |
| US7189596B1 | Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures | Electricity | 111 | Expired |
| US6808954B2 | Vacuum-cavity MEMS resonator | Electricity | 109 | Expired |
| US6852926B2 | Packaging microelectromechanical structures | Electricity | 86 | Expired |
| US6573822B2 | Tunable inductor using microelectromechanical switches | Electricity | 84 | Expired |
| US6621137B1 | MEMS device integrated chip package, and method of making same | Emerging Cross-Sectional Technologies | 84 | Expired |
| US6586836B1 | Process for forming microelectronic packages and intermediate structures formed therewith | Electricity | 74 | Expired |
| US6903452B2 | Packaging microelectromechanical structures | Electricity | 74 | Expired |
| US6954020B2 | Apparatus for adjusting the resonance frequency of a microelectromechanical (MEMS) resonator using tensile/compressive strain and applications thereof | Electricity | 70 | Expired |
| US6617682B1 | Structure for reducing die corner and edge stresses in microelectronic packages | Electricity | 68 | Expired |
| US6812814B2 | Microelectromechanical (MEMS) switching apparatus | Electricity | 62 | Expired |
| US6794223B2 | Structure and process for reducing die corner and edge stresses in microelectronic packages | Electricity | 58 | Expired |
| US6825063B2 | Integrated core microelectronic package | Emerging Cross-Sectional Technologies | 54 | Expired |
| US7002436B2 | Vacuum-cavity MEMS resonator | Electricity | 53 | Expired |
| US6219243A | Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units | Electricity | 50 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.