Method of filling a recess
US6423635B1 · kind B1 · utility
0Cited by
8References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 17, 2000 |
| Grant date | Jul 23, 2002 |
| Priority date | — |
| Expiry date | Mar 17, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for filling a multiplicity of recesses (3) formed in an exposed surface of a workpiece (1), wherein the mouths of the recesses (3) are closed by the deposition of a layer (10) and the layer is subjected to elevated temperature and pressure to force material from the layer down into the recesses. In the particular embodiments described, the elevated temperature is achieved by supplying very short thermal pulses, for example, from a light source such as a laser or a halogen light and preferably this thermal pulse is applied after the elevated pressure has been achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.