Vibration resistant test module for use with semiconductor device test apparatus

US6424167B1 · kind B1 · utility

Assignee

• NATIONAL SEMICONDUCTOR CORPORATION · US

Inventors

• Gengying Gao · Fremont, US
• Kevin Weaver · San Jose, US

Key dates

• Filing date: Mar 22, 2000
• Grant date: Jul 23, 2002
• Expiry date: Mar 22, 2020

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2889
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A vibration resistant test module for use with semiconductor device test apparatus that includes a test module top plate, a test module bottom plate and a plurality of spring-and-wire assemblies. The test module top and bottom plates each have a plurality of openings extending between their upper and lower surfaces. Each of the spring-and-wire assemblies includes an electrically conducting wire with a top wire end and a bottom wire end, a top electrically conducting spring connector attached to the top wire end, and a bottom electrically conducting spring connector attached to the bottom wire end. The spring-and-wire assemblies are threaded through separate openings in the test module top and bottom plates such that the top electrically conducting spring connectors extend above the upper surface of the test module top plate, while the bottom electrically conducting spring connectors extend below the lower surface of the test module bottom plate. The top and bottom electrically conducting spring connectors are used to make secure and vibration resistant electrical connections between the vibration resistant test module and other semiconductor device test apparatus components.