Conductive adhesive having a palladium matrix interface between two metal surfaces
US6425772B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2001 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Jul 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12569
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces. The resulting bond is preferably between metal contact pads on a dielectric substrate and on an electronic device. The connection is provided by utilizing a conductive adhesive wherein the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. The polymer preferably is conventional polyimide/siloxane which is a thermoplastic, i.e. upon heating softens and upon cooling sets, and upon reheating will soften and reflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.