Polishing apparatus
US6425809B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2000 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Feb 15, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus for polishing a plate-like member such as semiconductor wafer with a high degree of polished surface flatness is provided. The apparatus comprises a turntable having a surface provided on its upper surface with a polishing pad having an upper or polishing surface, and a carrier having an article holding surface for holding thereon a plate-like article. The carrier is adapted to press a surface of the plate-like article against the polishing surface of the polishing pad to polish and flatten the surface of the plate-like article by relative movement between the article and the polishing surface. An annular member is provided along the peripheral edge of the plate-like article between the article holding surface and the plate-like article to form a chamber therebetween, and a pressurized fluid source is fluidly connected to the chamber for supplying a pressurized fluid into the chamber. The polishing surface of the polishing pad is provided with grooves to divide the polishing surface into a number of sections. The chamber may be divided into outer and inner chamber sections so that the pressures in those chamber sections can be controlled, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.