Method for producing conductor interconnect with dendrites
US6427323B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2001 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | May 17, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49194
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.”
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.