Inherently robust repair process for thin film circuitry using UV laser
US6427324B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1998 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Nov 10, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer thin film structure having defined strap repair lines thereon and a method for repairing interconnections in the multilayer thin film structure (MLTF) and/or making engineering changes (EC) are provided. The method comprises determining interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, defining the top surface metallization including a series of orthogonal X conductor lines and Y conductor lines using photoresist and lithography and additive or phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.