Plasma processing device and plasma processing method
US6427621B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Apr 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32192
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In the plasma processing device for supplying electromagnetic waves to the first plate, generating plasma in the vacuum atmosphere between the first plate and the second plate which is arranged opposite to it, and processing the board loaded on the second plate, wherein the dielectric window for propagating electromagnetic waves is installed in the outer periphery of the first plate and in the window, the electromagnetic wave distribution corrector composed of an electrical conductor or a dielectric is embedded away from the first plate so that at least the side and bottom of the electromagnetic wave distribution corrector are not exposed in the aforementioned vacuum atmosphere. The electromagnetic wave distribution corrector corrects one-siding of the plasma density distribution at the center.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.