Compact load lock system for ion beam processing of foups
US6428262B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Aug 10, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The system processes one or more wafers from a FOUP to an ion processing chamber. A group of wafers from the FOUP is removed by a first end effector and loaded into a load lock through a lower door in an atmosphere opened position. The load lock is sealed, evacuated, and an upper door is opened to a vacuum opened position. A second end effector connected to a 3-axis robot moves one of the wafers from the load lock to the ion processing chamber. A wafer alignment robot can also be used. Wafers are sequentially processed from the load lock to the processing chamber until complete; and then the wafers within the load lock are sealed, pressurized, and moved back to the FOUP. A second load lock, and multiple FOUPs, are used to increase throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.