Metal foil laminated IC package
US6429048B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2000 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | Dec 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an integrated circuit package for ball grid arrays, comprising the steps of: laminating layers of fiberglass prepreg and copper foil to a copper plate in order to create a three-layer laminated carrier; patterning and etching contact pads for input/output and a power/ground ring; applying a solder mask and plating up the contact pads and the ring with a wire bondable metal surface; forming window openings for receiving semiconductor dies; attaching the dies within the windows, wire bonding the dies to the contact pads and the ring, encapsulating the dies, attaching solder balls to the contact pads to create finished packages and singulating the finished packages into individual packages; and attaching the copper plate portion of each of the individual packages to copper plate heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.