Liquid damping of high frequency bond wire vibration
US6429510B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 30, 2001 |
| Grant date | Aug 6, 2002 |
| Priority date | — |
| Expiry date | May 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of conductors and an electrical component are disposed on a substrate, wherein the electrical component has a plurality of leads that are connected to the conductors on the substrate by a plurality of bond wires. A damping material is then situated in contact with the plurality of bond wires, the damping material chosen so that the plurality of bond wires can move in relation to the damping material. The damping material may be a viscous liquid kept in contact with the bond wires by a containing lid attached to the substrate. Alternatively, the damping material may be a colloidal mixture involving a liquid or an elastomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.