Thomas W. Moller
15Patents
9h-index
17Co-inventors
65Inventor score
Filing activity: Jul 19, 1996 → Jul 26, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5933327A | Wire bond attachment of a integrated circuit package to a heat sink | Electricity | 211 | Expired |
| US7372334B2 | Output match transistor | Electricity | 43 | Expired |
| US6515235B2 | Liquid dielectric tuning of an integrated circuit | Electricity | 34 | Expired |
| US5877555A | Direct contact die attach | Electricity | 19 | Expired |
| US6614308B2 | Multi-stage, high frequency, high power signal amplifier | Electricity | 15 | Expired |
| US6181006A | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink | Electricity | 14 | Expired |
| US6160710A | Capacitive mounting arrangement for securing an integrated circuit package to a heat sink | Electricity | 13 | Expired |
| US5889319A | RF power package with a dual ground | Electricity | 12 | Expired |
| US6414389B1 | Alignment pedestals in an LDMOS power package | Electricity | 11 | Expired |
| US6392298B1 | Functional lid for RF power package | Electricity | 9 | Expired |
| US5869897A | Mounting arrangement for securing an intergrated circuit package to heat sink | Electricity | 7 | Expired |
| US5982000A | Resistive interconnect of transistor cells | Electricity | 6 | Expired |
| US6429510B1 | Liquid damping of high frequency bond wire vibration | Electricity | 6 | Expired |
| US6818951B2 | Arrangement in a power mosfet | Electricity | 4 | Expired |
| US6791419B1 | Constant gain, constant phase RF power block | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.