Apparatus and method for washing substrate
US6431184B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 28, 1998 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Jul 28, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an apparatus for washing a substrate, comprising a spin chuck holding and rotating a substrate, a process solution supply mechanism having a solution discharge port through which a process solution is supplied onto the substrate rotated by the spin chuck so as to form a film of the process solution, an ultrasonic oscillator for applying an ultrasonic vibration to the film of the process solution, a relative moving mechanism for relatively moving the ultrasonic oscillator and the spin chuck so as to adjust the relative positions of the ultrasonic oscillator and the substrate, and controller for controlling each of the spin chuck, process solution supply mechanism, ultrasonic oscillator and relative moving mechanism so as to permit the ultrasonic oscillator, which extends to cover substantially a radius of the substrate, to be in contact with the film of the process solution but not to be in contact with the substrate and so as to make optimum the relationship among a gap G between the ultrasonic oscillator and the substrate, a supply amount Q of the process solution, and a rotating speed V of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.