Transfer device for semiconductor wafers
US6431811B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2000 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | May 10, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to achieve a higher compaction ratio with a wafer transfer apparatus for transferring wafers stacked in an interspaced manner in a first holding device, e.g. a magazine, to a second holding device, which has a carrier device which is provided with two rollers which are arranged parallel to one another and can each be rotated about its longitudinal axis, the rollers can be arranged in a plurality of rotational positions, each roller is provided with a plurality of wafer receptacles extending over at least part of their circumference, some of the receptacles are arranged offset both in the longitudinal direction and in the circumferential direction of the roller and are arranged in segment portions of the circumference of the roller which extend essentially parallel to the longitudinal axis of the respective roller, the proposal according to the invention is that in at least three segment portions (14, 15, 16, 17, 18, 19) there are receptacles (6) for wafers of in each case at least one wafer stack, at least a fourth segment portion (14-19) is formed, in which there are receptacles for the simultaneous arrangement of wafers of at least three wafer stacks, receptacles of diff…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.