Surface treatment in a fabrication of a multilayered chip component
US6431956B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2000 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Jun 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An inventive method for fabricating a multilayered ceramic electronic component comprises the steps of: preparing a multilayered ceramic body and abrasive powders into an abrader; abrading the multilayered ceramic body for smoothing edge portions of the multilayered ceramic body; and separating the multilayered ceramic body from the abrasive powders, wherein the abrasive powders are porous and includes fat and oil, in such a way that the abrasive powders allow undesirable wastes produced from the multilayered ceramic body to adhere thereto during the abrading step, thereby resulting in preventing internal or external electrodes of the multilayered ceramic body from being contaminated by the undesirable wastes, and improving the electrical properties of the multilayered ceramic electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.