Microfabricated structures with trench-isolation using bonded-substrates and cavities
US6433401B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2000 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Apr 5, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0814
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microstructure and method for forming the microstructure are disclosed. The method includes: providing a handle substrate; providing a device substrate in which high-aspect-ratio structures and optional integrated circuitry will be fabricated; forming one or more filled isolation trenches within a recessed cavity on a first surface of the device substrate or alternatively forming one or more filled isolation trenches on a first surface of the device substrate and forming a recessed cavity on a first surface of the handle substrate; bonding the first surface of the device substrate to the first surface of the handle substrate; removing a substantially uniform amount of material from the second surface of the device substrate to expose at least one isolation trench; optionally forming circuits and interconnection on a second surface of the device substrate; and etching a set of features in the second surface of the device substrate to complete the definition of electrically isolated structural elements.The micromechanical device includes: a device substrate having a first surface, a second surface, and a semiconductor layer; a handle substrate, the first surface of the device subst…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.