Semiconductor processing apparatus with substrate-supporting mechanism
US6435798B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Apr 7, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor processing apparatus for processing a semiconductor substrate includes: (i) a vacuum-exhausted chamber; (ii) a susceptor which is provided within the chamber and which holds the substrate and has at least three through-holes; (iii) substrate-supporting members which are supported within the through-holes and which support the substrate; (iv) a pin, one end of which is inserted into the inner part of a the substrate-supporting member; and (v) a pin-fixing structure provided at the base of the chamber for fixing the other end of the pin. When the susceptor moves downward, the pin pushes up the substrate-supporting member, and the substrate is supported in midair by the substrate-supporting members apart from the susceptor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.