CMP polishing pad including a solid catalyst
US6435947B2 · kind B2 · utility
24Cited by
22References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Jan 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing pad comprising a polishing pad substrate and at least one solid catalyst, the polishing pad being useful to remove metal layers from a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.