Object separating apparatus and method, and method of manufacturing semiconductor substrate
US6436226B1 · kind B1 · utility
18Cited by
12References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1998 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Dec 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for separating a substrate having a porous layer at the porous layer is provided. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (108, 109) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (112) and injected against the bonded substrate stack (101), thereby physically separating the bonded substrate stack (101) into two substrates. The jet pressure is appropriately changed in accordance with progress of separation processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.