Patent · US Expired

Apparatus for treating wastewater from a chemical-mechanical polishing process used in chip fabrication

US6436281B2 · kind B2 · utility

4Cited by

7References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Jürgen Hammer · Idar-Oberstein, DE
Andre Richter · Neustadt in Sachsen, DE
Werner Kraus · Teublitz, DE
Heinz-Dieter Petermann · Stuttgart, DE

Key dates

Filing date	Apr 10, 2001
Grant date	Aug 20, 2002
Priority date	—
Expiry date	Apr 10, 2021

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC02F1/442
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

Wastewater from a chemical-mechanical polishing process (CMP) used in semiconductor chip fabrication has hitherto been, and is still being, discharged into the public sewage system after chemical neutralization and sedimentation. This has the drawback that water consumption is considerable. It is therefore an object of the invention to reduce the total amount of wastewater produced that has to be discharged. This is achieved by the wastewater to be treated being subjected to an ultra-filtration. This allows the treated CMP wastewater to be reused within the plant. In particular, it can be recycled in order again to recover therefrom deionized water of a very high purity for operational purposes, e.g. for CMP.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.