Method of manufacturing electronic components

US6436300B2 · kind B2 · utility

Assignee

• Motorola, Inc. · US

Inventors

• Eric Woolsey · Gilbert, US
• Douglas G. Mitchell · Tempe, US
• George F. Carney · Tempe, US
• Francis J. Carney · Mesa, US
• Cary B. Powell · Tempe, US

Key dates

• Filing date: Jul 30, 1998
• Grant date: Aug 20, 2002
• Expiry date: Jul 30, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of manufacturing electronic components includes disposing a top metal layer (502) comprised of solder over a bottom metal layer (201, 202) comprised of titanium or tungsten, and selectively etching the bottom metal layer (201, 202) over the top metal layer (502) with an etchant mixture (601) comprised of an etchant, an additive to control the temperature of the etchant mixture (601), and another additive to reduce the redeposition of the top layer (502).