Eric Woolsey
10Patents
4h-index
12Co-inventors
57Inventor score
Filing activity: Dec 26, 1995 → Jun 25, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5773359A | Interconnect system and method of fabrication | Electricity | 145 | Expired |
| US6436300B2 | Method of manufacturing electronic components | Electricity | 10 | Expired |
| US8722528B2 | Die backside standoff structures for semiconductor devices | Electricity | 6 | Active |
| US6413878B1 | Method of manufacturing electronic components | Electricity | 5 | Expired |
| US7655539B2 | Dice by grind for back surface metallized dies | Electricity | 3 | Active |
| US10818587B2 | Semiconductor device and method of forming a curved image sensor | Electricity | 1 | Active |
| US11605576B2 | Via for semiconductor devices and related methods | Electricity | 1 | Active |
| US8314473B2 | Die backside standoff structures for semiconductor devices | Electricity | 0 | Active |
| US11127018B2 | Secure access-based resource delegation | Electricity | 0 | Active |
| US10115662B2 | Semiconductor device and method of forming a curved image sensor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.