Process for producing semiconductor chip
US6436795B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Feb 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing semiconductor chips, comprising the following steps. A semiconductor wafer having a surface overlaid with circuits is provided. An arrangement wherein a back of the semiconductor wafer is fixed on a dicing tape and wherein a pressure sensitive adhesive double coated sheet is stuck to a circuit surface of the semiconductor wafer is formed. The pressure sensitive adhesive double coated sheet comprises a shrinkable base having its both sides overlaid with pressure sensitive adhesive layers. At least one of the layers is composed of an energy radiation curable pressure sensitive adhesive. The semiconductor wafer together with the pressure sensitive adhesive double coated sheet is diced by each circuit to thereby form semiconductor chips. The semiconductor chips are fixed on a transparent hard plate by adherence of the pressure sensitive adhesive layer of the pressure sensitive adhesive double coated sheet remote from the semiconductor chips. The dicing tape is stripped from the semiconductor chips. The pressure sensitive adhesive double coated sheet, on its transparent hard plate side, is irradiated with energy radiation. The shrink base of the pressure sensitiv…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.