Vapor chamber system for cooling mobile computing systems
US6437983B1 · kind B1 · utility
11Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system including a vapor chamber including a liquid. The vapor chamber is coupled with a die. The vapor chamber is attached to a plurality of micro pipes (MPs). When heat is generated by the die, the liquid is vaporized in the vapor chamber generating vapor. The vapor flows through the MPs to condensation ends of the MPs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.