Eric Distefano
47Patents
14h-index
49Co-inventors
81Inventor score
Filing activity: Dec 29, 1999 → Aug 4, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6415612B1 | Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler | Electricity | 68 | Expired |
| US7023697B2 | Actuation membrane for application to a card slot of a system | Electricity | 42 | Expired |
| US6924978B2 | Method and system for computer system ventilation | Physics | 38 | Expired |
| US6674640B2 | Increased thermal capability of portable electronic device in stationary or docked mode | Physics | 36 | Expired |
| US6459573B1 | Mobile computer having a housing with openings for cooling | Physics | 32 | Expired |
| US7596464B2 | Determining the thermal influence of components within a system and usage of a matrix for power and thermal management | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6837057B2 | Docking station to cool a computer | Mechanical Engineering; Lighting; Heating | 28 | Expired |
| US7259965B2 | Integrated circuit coolant microchannel assembly with targeted channel configuration | Electricity | 24 | Expired |
| US6469893B1 | Direct heatpipe attachment to die using center point loading | Electricity | 23 | Expired |
| US7272006B2 | IC coolant microchannel assembly with integrated attachment hardware | Electricity | 19 | Expired |
| US6577502B1 | Mobile computer having a housing with openings for cooling | Physics | 16 | Expired |
| US6625022B2 | Direct heatpipe attachment to die using center point loading | Electricity | 16 | Expired |
| US6903930B2 | Parallel heat exchanger for a component in a mobile system | Electricity | 14 | Expired |
| US6570764B2 | Low thermal resistance interface for attachment of thermal materials to a processor die | Electricity | 14 | Expired |
| US6845008B2 | Docking station to cool a notebook computer | Physics | 13 | Expired |
| US7878016B2 | Device and method for on-die temperature measurement | Physics | 13 | Active |
| US6906919B2 | Two-phase pumped liquid loop for mobile computer cooling | Physics | 13 | Expired |
| US6831836B2 | Low thermal resistance interface for attachment of thermal materials to a processor die | Electricity | 13 | Expired |
| US7131487B2 | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers | Electricity | 11 | Expired |
| US6437983B1 | Vapor chamber system for cooling mobile computing systems | Electricity | 11 | Expired |
| US7269005B2 | Pumped loop cooling with remote heat exchanger and display cooling | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6795311B2 | Method and apparatus for cooling portable computers | Physics | 8 | Expired |
| US7360945B2 | Apparatus for determining temperature of a portable computer system | Physics | 7 | Expired |
| US7164580B2 | Plenum-based computer cooling system | Physics | 5 | Expired |
| US9052901B2 | Method, apparatus, and system for energy efficiency and energy conservation including configurable maximum processor current | Emerging Cross-Sectional Technologies | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.