Automated semiconductor immersion processing system
US6439824B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jul 7, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.