Molded non-abrasive substrate carrier for use in polishing operations
US6439984B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 16, 1999 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Sep 16, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2081/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Thin, planar substrates are carried on a substrate carrier (20) through a polishing operation. The substrate carrier (20) is injection molded or modified-injection molded from a plastic material, and includes one or more receptacles for receiving the substrates to be carried through the polishing process. A drive force transmission arrangement is also included in the substrate carrier (20) through which the carrier may be driven in the polishing process. The substrate carrier (20) is relatively non-abrasive and composed of melt processable engineering polymers or blends. Non-abrasive fillers or reinforcing material may also be included in the plastic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.