Method of depositing buffer layers on biaxially textured metal substrates
US6440211B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1999 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Sep 30, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D2201/05
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminate article comprises a substrate and a biaxially textured (RE1xRE2(1−x))2O3 buffer layer over the substrate, wherein 0<x<1 and RE1 and RE2 are each selected from the group consisting of Nd, Sm, Eu, Ho, Er, Lu, Gd, Tb, Dy, Tm, and Yb. The (RE1xRE2(1−x))2O3 buffer layer can be deposited using sol-gel or metal-organic decomposition. The laminate article can include a layer of YBCO over the (RE1xRE2(1−x))2O3 buffer layer. A layer of CeO2 between the YBCO layer and the (RE1xRE2(1−x))2O3 buffer can also be include. Further included can be a layer of YSZ between the CeO2 layer and the (RE1xRE2(1−x))2O3 buffer layer. The substrate can be a biaxially textured metal, such as nickel. A method of forming the laminate article is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.