Planarization method and system using variable exposure
US6440644B1 · kind B1 · utility
4Cited by
19References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1999 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Nov 10, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2026
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and system for planarization is disclosed. The system includes a mask including a medium density, sub-resolution region which allows less than the full intensity of the exposing radiation through to a resist layer. By including multiple density regions, improved planarization can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.