Method of adding bias-independent aluminum bridged anti-fuses to a tungsten plug process
US6440781B1 · kind B1 · utility
4Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2001 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jun 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-terminal integrated circuit device structure is provided that relies upon the formation of an anti-fuse through a silicon substrate with the melting and flowing of an aluminum/aluminum alloy to create the current path. The use of an oversized contact permits the Tungsten plug to be eliminated from the anti-fuse structure, but allows the aluminum melt and flow mechanism to be used with a Tungsten plug process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.