Process of manufacturing a DRAM cell capacitor having increased trench capacitance
US6440813B2 · kind B2 · utility
3Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2001 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Jan 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/047
Abstract
A trench capacitor having an increased surface area. In one embodiment, the trench capacitor is a dual trench capacitor having a first trench and a second trench wherein inner walls of the trenches electrically connect. The invention also includes a single trench capacitor wherein the trench is curved around an axis substantially perpendicular to a substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.