Patent · US Expired

Process of manufacturing a DRAM cell capacitor having increased trench capacitance

US6440813B2 · kind B2 · utility

3Cited by
9References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 23, 2001
Grant dateAug 27, 2002
Priority date
Expiry dateJan 23, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D1/047

Abstract

A trench capacitor having an increased surface area. In one embodiment, the trench capacitor is a dual trench capacitor having a first trench and a second trench wherein inner walls of the trenches electrically connect. The invention also includes a single trench capacitor wherein the trench is curved around an axis substantially perpendicular to a substrate surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.